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ADVANCED PACKAGING EQUIPMENT AND WAFER LEVEL PACKAGING SERVICES

Advanced Packaging Equipment

Discover our revolutionary Advanced Packaging Equipment for automated and high precision manufacturing.

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Wafer Level Packaging Services

Engage with us for highly customized Wafer Level Packaging services with our line-up of edge-leading capabilities installed.

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Chemicals

We are supplying complete plating solutions by utilizing our plating know-how for a guaranteed process transfer.

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ADVANCED PACKAGING EQUIPMENT

2024-01-08T10:38:16+01:00

LaPlace – FC

The LaPlace-System provides an integrated solution for flip chip assembly for laser assisted soldering, ACF and NCP interconnections.

2023-01-27T11:13:27+01:00

SB² – SMs Quantum

SB²-SMs Quantum is highly recommended solution for high volume production. It achieves high throughput with dual loading station/drawer system that realize continuous production.

2023-01-27T11:04:22+01:00

SB² – Compact

SB²-Compact machine is the SB² entry point for high volume production with highly flexible and ultra-compact workstation.

2023-03-17T09:32:42+01:00

SB² – SM

The SB2-SM is a machine for prototyping and small volume production that has wider working area than the SB2-M and more optional features.

2023-05-31T10:33:30+02:00

SB² – USP

Highly flexible laser soldering and assembly platform for SMT components, especially for high-volume production in the automotive industry.

2023-01-27T10:37:53+01:00

LaPlace – HT

The LaPlace-HT is an automatic Laser Soldering machine for assembly of e.g. Schottky Diodes and Bypass Diodes – especially for solar cell modules.

2023-01-27T10:35:59+01:00

LaPlace – Can

Ultra-Fine-Pitch Cantilever Assembly and Laser Bonding for Wafer Probe Cards with optional Rework Capability.

WAFER LEVEL PACKAGING SERVICES

Electroplating

Electroplating, or electrochemical deposition, is the process of using electrodeposition to coat an object in a layer of metal(s) on any substrate. RDL and Copper for example, are part of this process.

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Electroless-Plating

Low-cost mask-less chemical deposition of various metal stacks on wafer surface to serve as intermetallic connection or to enhance product reliability and performance.

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Laser Assisted Bonding

Laser assisted bonding is an interconnection method performed through the laser energy to bond two surfaces of materials together.

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Solder Balling

Various solder deposition technologies to form solder bump for WLCSP and flip chip interconnects.

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Wafer Level Component Assembly

Wafer level assembly by attaching of dies or various passive components on wafer surface.

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Wafer Thinning

Thinning of wafer backside for dies in final packaging.

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Wafer Metal Coating

Application of various metal stacks via evaporation or sputtering technologies on wafer backside for better die performance.

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Wafer Dicing

High precision and accurate singulation of dies on a wafer.

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